Here is tips to reassemble the IC Component on Cellphone :
- To IC put back on the phone beforehand erode first IC legs evenly on the phone that was in the lift,
after the net, immediately applying solder paste on the area of IC and wiped with edged rungcing ordinary solder element is clean, - to note the erosion of these areas is not allowed any tin plate IC position is lost is to do with the direction of erosion.
- After a flat area, wash again with liquid IPA and note the direction of the IC area properly, so when putting the IC in order to facilitate the installation of mobile phone IC back on the machine.
- Installation step is applying solder paste on the area of the flat the following on the upper side of IC, IC elbows to place a limit order is not reversed at the time of installation of the mobile machine.
- Once ready, Align temperature parameters at temperatures ranging from 275 C to the air pressure at the level 2, then Blou with directions crossed like locking bolt, on this condition and make sure IC IC will dry will not change its position due to the air pressure steam solder.
- Raise the temperature of solder vapors in the range of 320 C with air pressure to the level of 2.5 and add the pasta back to keep the IC is not excessively hot.
- To ensure that the IC embedded in the phone, by tapping the little pointy tweezers seen with IC will sway slightly, an indication it indicates that the IC has been attached to the phone machine.
- Let stand for a moment of the phone machine on Blou to cool, then wipe with liquid IPA, IPA liquid is dried by solder vapors with minimum temperature until the liquid dries.
- With the above process has been accomplished, then it's done installing the IC on the phone and put the phone back later on.
